W29N02KVBIAF - Winbond
Description: Basic Features – Density: 2Gbit (Single chip solution) – Vcc: 2.7V to 3.6V – Bus width: x8 – Operating temperature Industrial: -40°C to 85°C Single-Level Cell (SLC) technology Organization – Density: 2G-bit/256M-byte – Page size 2,176 bytes – Block size 64 pages Highest Performance – Read performance (Max.) Random read: 25us Sequential read cycle: 25ns – Write Erase performance Page program time: 250us (typ.) Block erase time: 2ms (typ.) – Endurance: 60,000 Erase/Pr