W632G Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W632GU8NB11W Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W632GU8NB11W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8NB12A Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GU8NB12A	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB11A Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB15A Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA96	BGA	W632GU6NB15A	3D model available Symbol and footprint available 3	1 Download Model

	W632GG8MB09S Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB09S	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB15I Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA78	BGA	W632GG8NB15I	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB15K Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6NB15K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8NB15S Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA78	BGA	W632GU8NB15S	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB12S Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W632GU6RB12S	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB12S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6MB12S	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB12A Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6NB12A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6MB09K Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6MB09K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB09K Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6RB09K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6MB09S Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6MB09S	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8NB11K Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W632GU8NB11K	3D model available Symbol and footprint available 3	1 Download Model

	W632GU8MB15W Winbond	1	VFBGA - 78	BGA	W632GU8MB15W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6QB-11 Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6QB-11	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB-12 Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GU8RB-12	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB15S Winbond	1	SDRAM - DDR3 Memory IC 1Gbit Parallel 667 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB15S	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB09S Winbond	1	VFBGA - 78	BGA	W632GU8MB09S	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB11S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6NB11S	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8NB12S Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GU8NB12S	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB11K Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W632GG8NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB12K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6MB12K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB12W Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6NB12W	3D model available Symbol and footprint available 3	1 Download Model
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