The TRCDRIVE pack™ is ROHM Semiconductor's latest innovation in silicon carbide (SiC) power modules, specifically designed for electric vehicle (xEV) traction inverters. This 2-in-1 SiC molded module integrates ROHM’s fourth-generation SiC MOSFETs, achieving an industry-leading power density that is 1.5 times higher than conventional SiC molded modules. This advancement significantly contributes to the miniaturization and efficiency of xEV inverters, addressing the growing demand for compact and high-performance power solutions in the automotive industry.
The TRCDRIVE pack™ features a unique structure that maximizes heat dissipation, allowing it to support power outputs up to 300kW. Its design includes control signal terminals with press-fit pins, enabling easy and quick connections by simply pushing the gate driver board from the top. Additionally, the module achieves low inductance (5.7nH) through a two-layer bus-bar structure, which contributes to reduced losses during switching operations.
To learn more, visit rohm.com.