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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W631GG6MB11S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6MB11S	3D model available Symbol and footprint available 3	1 Download Model
	W957D8MFYA5A Winbond	1	Interface: HyperBus• Power supply: 1.7V~2.0V or 2.7V~3.6V• Maximum clock rate: 200MHz• Double-Data Rate (DDR) Up to 400 MT/s• Clock:– Single ended clock (CK)– Differential clock (CK/CK#)• Chip Select (CS#)• 8-bit data bus (DQ[7:0])• Hardware reset (RESET#)• Read-Write Data Strobe (RWDS)– Bidirectional Data Strobe / Mask– Output at the start of all transactions to indicaterefresh latency– Output during read transactions as Read DataStrobe– Input during write transactions as Wr	BGA	W957D8MFYA5A	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6KB18K Winbond	1	512Mb DDR2 SDRAM 1066MHz WBGA84	BGA	W9751G6KB18K	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB09I Winbond	1	Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, dif	BGA	W631GU8RB09I	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHS Winbond	1	BGA100	BGA	W66AP6NBHAHS	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80RVSNJM Winbond	1	8Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q80RVSNJM	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB15A Winbond	1	SDRAM - DDR3 Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GG8MB15A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB12K Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W631GU8RB12K	3D model available Symbol and footprint available 3	1 Download Model
	W957D8MFYA5K Winbond	1	128Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W957D8MFYA5K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVSFSM Winbond	1	32Mb Serial NOR Flash 133MHz SOP16	Small Outline Packages	W25Q32JVSFSM	3D model available Symbol and footprint available 3	1 Download Model
	W978H6KBVA1K Winbond	1	256Mb Low Power DDR2 SDRAM 1066MHz VFBGA134	BGA	W978H6KBVA1K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB12S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB12S	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512JVFJQ Winbond	1	512Mb Serial NOR Flash 133MHz SOP16	Small Outline Packages	W25Q512JVFJQ	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAFK Winbond	1	1Gb Low Power DDR4/4X SDRAM 3200MHz VFBGA100	BGA	W66AP6NBHAFK	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVFAM Winbond	1	512Mb Serial NOR Flash 104MHz SOP16 2.7V - 3.6V -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125℃	Small Outline Packages	W25M512JVFAM	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB09S Winbond	1	32M x 8 BANKS x 8 BIT DDR3L SDRAM	BGA	W632GU8RB09S	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB11I Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU6RB11I	3D model available Symbol and footprint available 3	1 Download Model
	W638GU6QB-11 Winbond	1	⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / r	BGA	W638GU6QB-11	3D model available Symbol and footprint available 3	1 Download Model
	W979H6KBVA2A Winbond	1	Low Power DDR2 SDRAM 800MHz	BGA	W979H6KBVA2A	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB15W Winbond	1	SDRAM - DDR3 Memory IC 1Gbit Parallel 667 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GG8MB15W	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB-12 Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W631GU8RB-12	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB12A Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB12A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZPSM Winbond	1	 New Family of SpiFlash Memories– W25Q64JV: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Low Power, Wide Temperature Range– Single 2.7 to 3.6V supply– <1µA Power-down (typ.)– -40°C to +85°C op	Small Outline No-lead	W25Q64JVZPSM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVTBAM Winbond	1	 New Family of SpiFlash Memories– W25Q32JV: 32M-bit / 4M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32/64-Byte	BGA	W25Q32JVTBAM	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZDJNA Winbond	1	FLASH - NAND (SLC) Memory IC 1Gbit ONFI 22 ns 48-VFBGA (8x6.5)	BGA	W29N01HZDJNA	3D model available Symbol and footprint available 3	1 Download Model
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