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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W957D6NBGX4I Winbond	1	128Mb HYPERRAM 500MHz WFBGA49	BGA	W957D6NBGX4I	3D model available Symbol and footprint available 3	1 Download Model
	W66BQ6NBUAGK Winbond	1	2Gb Low Power DDR4/4X SDRAM 3733MHz WFBGA200	BGA	W66BQ6NBUAGK	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB11W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W634GG6NB11W	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZSJNA Winbond	1	1Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N01HZSJNA	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB11J Winbond	1	Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, dif	BGA	W631GU8RB11J	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GWZEJG Winbond	1	1Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N01GWZEJG	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB25W Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G6NB25W	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHK Winbond	1	1Gb Low Power DDR4/4X SDRAM 4267MHz VFBGA100	BGA	W66AP6NBHAHK	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GVSFKG Winbond	1	New W25N Family of SpiFlash Memories– W25N01GV: 1G-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– Fast Program/Erase performance– More than 100,000 erase/program cycles(4)– More than 10-year data reten	Small Outline Packages	W25N01GVSFKG	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8NB15W Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA78	BGA	W632GU8NB15W	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB11K Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W634GU6RB11K	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB18J Winbond	1	DDR2 SDRAM 1066MHz	BGA	W972GG6KB18J	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6MB15A Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA96	BGA	W632GU6MB15A	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB12S Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GG8NB12S	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80EWBYIQ Winbond	1	• Family of SpiFlash Memories– 8M-bit/1M-byte (1,048,576)– 256-byte per programmable page– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3• Highest Performance Serial Flash– 104MHz Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– Up to 6X that of ordinary Serial Flash– Min 100K Program-Erase cycles per sector– More than 20-y	BGA	W25Q80EWBYIQ	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB18W Winbond	1	DDR2 SDRAM 1066MHz	BGA	W972GG6KB18W	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAGJ Winbond	1	VFBGA100	BGA	W66AQ6NBHAGJ	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHJ Winbond	1	VFBGA100	BGA	W66AP6NBHAHJ	3D model available Symbol and footprint available 3	1 Download Model
	W25N512GWEIU Winbond	1	512Mb Serial NAND Flash Memory with uniform 2KB+64B page size and set Buffer Read Mode as default	Small Outline No-lead	W25N512GWEIU	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KVZPIR Winbond	1	1Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N01KVZPIR	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWCAM Winbond	1	 New Family of SpiFlash® Memories– W25M512JW-IQ: 2 x 256M-bit (2 x 32MByte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 52MB/s continuous data transfer rate– More than 100,000 Program/Erase cycles– More than 20-year data retention	BGA	W25M512JWCAM	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB-3K Winbond	1	DDR2 SDRAM 667MHz	BGA	W972GG6KB-3K	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB11A Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W634GG8NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GVZEAG Winbond	1	1Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N01GVZEAG	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB09K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6NB09K	3D model available Symbol and footprint available 3	1 Download Model
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