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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W956D8MBYA5K Winbond	1	64Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W956D8MBYA5K	3D model available Symbol and footprint available 3	1 Download Model
	W97AH6NBVA1A Winbond	1	PACKAHE-BHA134	BGA	W97AH6NBVA1A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q128JVPIN Winbond	1	128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI	Small Outline No-lead	W25Q128JVPIN	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVSNAM Winbond	1	New Family of SpiFlash Memories– W25Q32JV: 32M-bit / 4M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32/64-Byte Wr	Small Outline Packages	W25Q32JVSNAM	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB09S Winbond	1	1Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W631GU6RB09S	3D model available Symbol and footprint available 3	1 Download Model
	W9816G6JH-7A Winbond	1	TSOP (TYPE II) 50L 400 mil	Small Outline Packages	W9816G6JH-7A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWXGSQ Winbond	1	Serial NOR Flash 104MHz	Small Outline No-lead	W25Q64JWXGSQ	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVSKNF Winbond	1	SLC NAND Flash MHz	Small Outline Packages	W29N01HVSKNF	3D model available Symbol and footprint available 3	1 Download Model
	W66BQ6NBUAHS Winbond	1	2Gb Low Power DDR4/4X SDRAM 4267MHz WFBGA200	BGA	W66BQ6NBUAHS	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8QB-09 Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W634GU8QB-09	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB15A Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB15A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB-09 Winbond	1	1Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W631GU6RB-09	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB09A Winbond	1	 Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V Backward compatible to VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, d	BGA	W631GU8MB09A	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB12K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6MB12K	3D model available Symbol and footprint available 3	1 Download Model
	W66BP6NBUAHS Winbond	1	2Gb Low Power DDR4/4X SDRAM 4267MHz WFBGA200	BGA	W66BP6NBUAHS	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB12A Winbond	1	DDR3 SDRAM 1600MHz	BGA	W634GU6RB12A	3D model available Symbol and footprint available 3	1 Download Model
	W97AH6NBVA2K Winbond	1	VFBGA134	BGA	W97AH6NBVA2K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80RVXHJQ Winbond	1	 New Family of SpiFlash Memories– W25Q80RV: 8M-bit / 1M-byte (1,048,576)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient “Continuous Read”– Continuous Re	Small Outline No-lead	W25Q80RVXHJQ	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6KB25W Winbond	1	512Mb DDR2 SDRAM 800MHz WBGA84	BGA	W9751G6KB25W	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB-12 Winbond	1	4Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W634GU6RB-12	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GVSAAF Winbond	1	8Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N08GVSAAF	3D model available Symbol and footprint available 3	1 Download Model
	W25N512GVEAG Winbond	1	512Mb QspiNAND Flash 166MHz SON8	Small Outline No-lead	W25N512GVEAG	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB18W Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB18W	3D model available Symbol and footprint available 3	1 Download Model
	W25N02JWZEAF Winbond	1	2Gb QspiNAND Flash 166MHz SON8	Small Outline No-lead	W25N02JWZEAF	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KVZEJR Winbond	1	1Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N01KVZEJR	3D model available Symbol and footprint available 3	1 Download Model
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