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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W29N01HZBKNF Winbond	1	SLC NAND Flash MHz	BGA	W29N01HZBKNF	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZSANA Winbond	1	1Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N01HZSANA	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB11A Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU8RB11A	3D model available Symbol and footprint available 3	1 Download Model
	W9864G6KH-5A Winbond	1	 3.3V ± 0.3V for -5, -6 and -6I speed grades power supply 2.7V~3.6V for -7 speed grades power supply Up to 200 MHz Clock Frequency 1,048,576 words  4 banks  16 bits organization Self Refresh Current: Standard and Low Power CAS Latency: 2 and 3 Burst Length: 1, 2, 4, 8 and full page Sequential and Interleave Burst Byte Data Controlled by LDQM, UDQM Auto-precharge and Controlled Precharg Burst Read, Single Writes Mode 4K Refresh Cycles/64 mS Interface: LVTTL Packaged	Small Outline Packages	W9864G6KH-5A	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8RB11S Winbond	1	DDR3 SDRAM 1866MHz	BGA	W634GU8RB11S	3D model available Symbol and footprint available 3	1 Download Model
	W979H6KBVA2W Winbond	1	134VFBGA	BGA	W979H6KBVA2W	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVCAM Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JVCAM	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB-3J Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB-3J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JWSNIM Winbond	1	New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR(Double Transfer Rate) Read– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20	Small Outline Packages	W25Q16JWSNIM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWTCIQ Winbond	1	New Family of SpiFlash Memories– W25Q32JW: 32M-bit / 4M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.7V to 1.95V supply– <0.1µA Power-down (typ.)– -40°C to +85/105°C operating rang	BGA	W25Q32JWTCIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWZEIQ Winbond	1	1Gb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q01NWZEIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWTBIQ Winbond	1	1Gb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q01NWTBIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q10EWUXIE Winbond	1	1Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25Q10EWUXIE	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JWSSIM Winbond	1	16Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q16JWSSIM	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB18I Winbond	1	512Mb DDR2 SDRAM 1066MHz VFBGA84	BGA	W9751G6NB18I	3D model available Symbol and footprint available 3	1 Download Model
	W948V6KBHX6E Winbond	1	256Mb Low Power DDR SDRAM 333MHz VFBGA60	BGA	W948V6KBHX6E	3D model available Symbol and footprint available 3	1 Download Model
	W968D6DAGX7I Winbond	1	This is a 256M bit CellularRAM™ compliant products, organized as 16M word by 16 bite; high-speed, CMOS pseudo-static random access memories developed for low-power, portable applications.	BGA	W968D6DAGX7I	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB11I Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W634GG8NB11I	3D model available Symbol and footprint available 3	1 Download Model
	W63AH6NBVABE Winbond	1	This is a 1Gb Low Power DDR3 SDRAM organized as 8M words x 8 banks x 16bits	BGA	W63AH6NBVABE	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZPJM Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JVZPJM	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB11J Winbond	1	DDR3 SDRAM 1866MHz	BGA	W634GG8NB11J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVTBSQ Winbond	1	32Mb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q32JVTBSQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZEJQ Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JVZEJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q40EWUXJE Winbond	1	4Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25Q40EWUXJE	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWUUJQ Winbond	1	64Mb Serial NOR Flash 133MHz SON8 ,4x3x0.60,uu package .	Other	W25Q64JWUUJQ	3D model available Symbol and footprint available 3	1 Download Model
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