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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W25N01GVTBAT Winbond	1	 New W25N Family of SpiFlash Memories– W25N01GV: 1G-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– Fast Program/Erase performance– 100,000 erase/program cycles(4)– 10-year data retention Efficient “	BGA	W25N01GVTBAT	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWZPAM Winbond	1	32Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25Q32JWZPAM	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB09J Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W632GU8RB09J	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6QB09I Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6QB09I	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB09I Winbond	1	1Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W631GU6RB09I	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8QB12I Winbond	1	4Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W634GU8QB12I	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWCSQ Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JWCSQ	3D model available Symbol and footprint available 3	1 Download Model
	W94AD6KBHA6K Winbond	1	1Gb Low Power DDR SDRAM 333MHz VFBGA60	BGA	W94AD6KBHA6K	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB25K Winbond	1	512Mb DDR2 SDRAM 800MHz VFBGA60	BGA	W9751G8NB25K	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVBAQ Winbond	1	512Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25M512JVBAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q12PWSSIM Winbond	1	New Family of SpiFlash Memories– W25Q12PW: 128M-bit / 16M-byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR(Double Transfer Rate) Read– On-chip ECC(1-Bit correction every 16-Byte)(1) Highest Performance Serial Flash–166MHz Quad I/O clocks– 83MB/S continuous data transfer rate– Min. 100K Program-Erase cycles(2)– More than 20-year data retention Efficie	Small Outline Packages	W25Q12PWSSIM	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB15A Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6MB15A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB12S Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB12S	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWFSM Winbond	1	Serial NOR Flash 104MHz	Small Outline Packages	W25M512JWFSM	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB09A Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU8RB09A	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB09S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB09S	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB15K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6MB15K	3D model available Symbol and footprint available 3	1 Download Model
	W9825G6KB-5A Winbond	1	256Mb SDRAM 200MHz TFBGA 54 2 mA 0°C ~ 70°C	BGA	W9825G6KB-5A	3D model available Symbol and footprint available 3	1 Download Model
	W9725G8KB18A Winbond	1	256Mb DDR2 SDRAM 1066MHz WBGA60	BGA	W9725G8KB18A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6NB12A Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W631GU6NB12A	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVDKNF Winbond	1	NAND Flash 1G-bit NAND flash, 3V, 1-bit ECC, 3V, 48 ball VFBGA (x8)	BGA	W29N01HVDKNF	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB11K Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6MB11K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB09W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB09W	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB11K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWBAM Winbond	1	512Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25M512JWBAM	3D model available Symbol and footprint available 3	1 Download Model
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