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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W632GU6QB-12 Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W632GU6QB-12	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB15S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6MB15S	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB09K Winbond	1	VFBGA - 78	BGA	W632GU8MB09K	3D model available Symbol and footprint available 3	1 Download Model
	W638GU6QB-09 Winbond	1	Data masks (DM) for write data⚫ Programmable CAS Write Latency (CWL) per operating frequency⚫ Write Latency WL = AL + CWL⚫ Multi purpose register (MPR) for readout a predefined system timing calibration bit sequence⚫ System level timing calibration support via write leveling and MPR read pattern⚫ ZQ Calibration for output driver and ODT using external reference resistor to ground⚫ Asynchronous RESET# pin for Power-up initialization sequence and reset function⚫ Programmable on-die termination (	BGA	W638GU6QB-09	3D model available Symbol and footprint available 3	1 Download Model
	W66BQ6NBUAFK Winbond	1	2Gb Low Power DDR4/4X SDRAM 3200MHz WFBGA200	BGA	W66BQ6NBUAFK	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB09K Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GG6MB09K	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB12S Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W631GU8RB12S	3D model available Symbol and footprint available 3	1 Download Model
	W9725G8KB-3A Winbond	1	DDR2 SDRAM 667MHz	BGA	W9725G8KB-3A	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8NB12K Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8NB12K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB12K Winbond	1	DDR3 SDRAM 1600M HzSDRAM - DDR3 Memory IC 2Gbit Parallel 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB12K	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB11S Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W634GU6RB11S	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAGA Winbond	1	1Gb Low Power DDR4/4X SDRAM 3733MHz VFBGA100	BGA	W66AP6NBHAGA	3D model available Symbol and footprint available 3	1 Download Model
	W25N04KWZEJR Winbond	1	New W25N Family of QspiNANDMemories– W25N04KW: 4G-bit / 512M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S sequential data transfer rate– Fast Program/Erase performance– 100,000 erase/program cycles(5) (6)– 10-year data retention Low Pow	Small Outline No-lead	W25N04KWZEJR	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAHS Winbond	1	VFBGA100	BGA	W66AQ6NBHAHS	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JLSNIG Winbond	1	Family of SpiFlash Memories– W25Q16JL: 16M-bit / 2M-byte (2,097,152)– 256-byte per programmable page– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 Highest Performance Serial Flash– 104MHz Dual SPI / Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– Up to 4X that of ordinary Serial Flash– Min. 100K Program-Erase cycles per sector– More than 20-year data retention	Small Outline Packages	W25Q16JLSNIG	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB09J Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6RB09J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q12PWZEIM Winbond	1	128Mb Serial NOR Flash 166MHz SON8	Small Outline No-lead	W25Q12PWZEIM	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GVTBKG Winbond	1	 New W25N Family of SpiFlash Memories– W25N01GV: 1G-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– Fast Program/Erase performance– More than 100,000 erase/program cycles(4)– More than 10-year data ret	BGA	W25N01GVTBKG	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB11K Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W634GG8NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB09W Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB09W	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB15S Winbond	1	SDRAM - DDR3 Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GG8MB15S	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB11W Winbond	1	 Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR) Precharged Power Down and Active Power Down Data masks (DM) for write data Programmable CAS Write Latency (CWL) per operating frequency Write Latency WL = AL + CWL Multi purpose register (MPR) for readout a predefined system timing calibration bit sequence System level timing calibration support via write leveling and MPR read pattern ZQ Calibration for output driver and ODT using external reference r	BGA	W631GG6MB11W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB15K Winbond	1	PACKAGE-BGA96	BGA	W632GU6NB15K	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB09J Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W634GU6RB09J	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB09K Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU8RB09K	3D model available Symbol and footprint available 3	1 Download Model
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