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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W632GG6MB15W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6MB15W	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB18W Winbond	1	DDR2 SDRAM 1066MHz	BGA	W9751G6NB18W	3D model available Symbol and footprint available 3	1 Download Model
	W94AD6KBHA6A Winbond	1	1Gb Low Power DDR SDRAM 333MHz VFBGA60	BGA	W94AD6KBHA6A	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB09W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6MB09W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB12W Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W632GU6NB12W	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB15K Winbond	1	DDR3 SDRAM 1333MHz Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB15K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWZEJM Winbond	1	 New Family of SpiFlash Memories– W25Q01NW: two 512M-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient “Continuous Read”– Quad Peri	Small Outline No-lead	W25Q01NWZEJM	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8RB12J Winbond	1	DDR3 SDRAM 1600MHz	BGA	W634GU8RB12J	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB11A Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W634GG6NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W9825G6KB-6J Winbond	1	256Mb SDRAM 166MHz TFBGA 54 5 mA -40°C ~ 105°C	BGA	W9825G6KB-6J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVSSSM Winbond	1	New Family of SpiFlash Memories– W25Q16JV: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32	Small Outline Packages	W25Q16JVSSSM	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAHA Winbond	1	BGA100	BGA	W66AQ6NBHAHA	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB15W Winbond	1	DDR3 SDRAM 1333MHz	BGA	W634GU8NB15W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB15W Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA96	BGA	W632GU6NB15W	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB-3K Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB-3K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWZEIN Winbond	1	Serial NOR Flash 133MHz	Small Outline No-lead	W25Q01NWZEIN	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32RVXHJQ Winbond	1	32Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q32RVXHJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KVZPJE Winbond	1	New W25N Family of QspiNANDMemories– W25N01KV: 1G-bit / 128M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– Fast Program/Erase performance– 100,000 erase/program cycles(3)– 10-year data retention Low Power, Wide Temperature Range– Single 2.7 to	Small Outline No-lead	W25N01KVZPJE	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB12W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W634GG6NB12W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB12I Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GU8RB12I	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB12K Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W632GU6NB12K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB09A Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6NB09A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB12J Winbond	1	⚫ Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, d	BGA	W631GU8RB12J	3D model available Symbol and footprint available 3	1 Download Model
	W25N01JWTBKG Winbond	1	 New W25N Family of SpiFlash Memories– W25N01JW: 1G-bit / 128M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold,– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI Serial Flash commands Highest Performance Serial NAND Flash– 166MHz Standard/Dual/Quad SPI clocks– 332/664MHz equivalent Dual/Quad SPI– DTR (Dual Transfer Rate) up to 80MHz– 80MB/s continuous data transfer rate– Fast Program/Erase performance– Endurance T.B.D Erase/Program C	BGA	W25N01JWTBKG	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6NB11K Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 933 MHz 20 ns 96-VFBGA (7.5x13)	BGA	W631GU6NB11K	3D model available Symbol and footprint available 3	1 Download Model
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