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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W9751G6NB25J Winbond	1	512Mb DDR2 SDRAM 800MHz VFBGA84	BGA	W9751G6NB25J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JWSNIQ Winbond	1	 New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.65V to 1.95V supply– <0.1µA Power-down (typ.)– -40°C to +85°C operating range	Small Outline Packages	W25Q16JWSNIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZPJQ Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JVZPJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JWZPIQ Winbond	1	FLASH - NOR Memory IC 16Mbit SPI - Quad I/O 133 MHz 8-WSON (6x5)	Small Outline No-lead	W25Q16JWZPIQ	3D model available Symbol and footprint available 3	1 Download Model
	W29N02GZSIBA Winbond	1	2Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N02GZSIBA	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWZEJQ Winbond	1	 New Family of SpiFlash Memories– W25Q64JW: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.7V to 1.95Vsupply– <1µA Power-down (typ.)– -40°C to +85°C operating range F	Small Outline No-lead	W25Q64JWZEJQ	3D model available Symbol and footprint available 3	1 Download Model
	W9816G6JH-7 Winbond	1	SDRAM 143MHz TSOPII50	Small Outline Packages	W9816G6JH-7	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVSIAA Winbond	1	• Basic Features– Density: 4Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature▪ Industrial: -40°C to 85°C• Single-Level Cell (SLC) technology• Organization– Density: 4G-bit/512M-byte– Page size▪ 2,112 bytes (2048 + 64 bytes)– Block size▪ 64 pages (128K + 4K bytes)• Highest Performance– Read performance (Max.)▪ Random read: 25us▪ Sequential read cycle: 25ns– Write Erase performance▪ Page program time: 250us(typ.)▪ Block erase time: 2ms(t	Small Outline Packages	W29N04GVSIAA	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB15J Winbond	1	DDR3 SDRAM 1333MHz	BGA	W634GG8NB15J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVTBIQ Winbond	1	32Mb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q32JVTBIQ	3D model available Symbol and footprint available 3	1 Download Model
	W959D8NFYA5I Winbond	1	512Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W959D8NFYA5I	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWZPJQ Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JWZPJQ	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB-3I Winbond	1	2Gb DDR2 SDRAM 667MHz WBGA84	BGA	W972GG6KB-3I	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB-3 Winbond	1	WFBGA84	BGA	W972GG6KB-3	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVXGIQ Winbond	1	32M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI	Small Outline No-lead	W25Q32JVXGIQ	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KVBIAE Winbond	1	2Gb SLC NAND Flash MHz VFBGA63	BGA	W29N02KVBIAE	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KVSIAE Winbond	1	 Basic Features– Density: 2Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature Industrial: -40°C to 85°C Industrial Plus: -40°C to 105°C Single-Level Cell (SLC) technology. Organization– Density: 2G-bit/256M-byte– Page size 2,176 bytes– Block size 64 pages Highest Performance– Read performance (Max.) Random read: 25us Sequential read cycle: 25ns– Write Erase performance Page program time: 250us (typ.) Block erase time: 2ms	Small Outline Packages	W29N02KVSIAE	3D model available Symbol and footprint available 3	1 Download Model
	W9825G6KH-75 Winbond	1	256Mb SDRAM 133MHz TSOPII54	Small Outline Packages	W9825G6KH-75	3D model available Symbol and footprint available 3	1 Download Model
	W25N512GVPIT Winbond	1	512Mb Serial NAND Flash Memory with uniform 2KB+64B page size and set Buffer Read Mode as default	Small Outline No-lead	W25N512GVPIT	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWZEIQ Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JWZEIQ	3D model available Symbol and footprint available 3	1 Download Model
	W9864G6KH-5I Winbond	1	64Mb SDRAM 200MHz TSOPII54	Small Outline Packages	W9864G6KH-5I	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB11I Winbond	1	The W631GG6NB is a 1G bits DDR3 SDRAM and speed involving -09, 09I, 09J, -11, 11I, 11J, -12, 12I, 12J, -15, 15I and 15J	BGA	W631GG6NB11I	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZESQ Winbond	1	 New Family of SpiFlash Memories– W25Q64JV: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Low Power, Wide Temperature Range– Single 2.7 to 3.6V supply– <1µA Power-down (typ.)– -40°C to +85°C op	Small Outline No-lead	W25Q64JVZESQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80DVSNIG Winbond	1	Family of SpiFlash Memories– W25Q80DV: 8M-bit/1M-byte (1,048,576)– 256-byte per programmable page– Standard SPI: CLK,/CS,DI,DO,/WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Uniform 4KB Sectors, 32KB & 64KB Blocks• Highest Performance Serial Flash– 104MHz Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate• Software and Hardware Write Protection– Write-Protect all or portion of memory– Enable/	Small Outline Packages	W25Q80DVSNIG	3D model available Symbol and footprint available 3	1 Download Model
	W97AH6NBVA1I Winbond	1	PACKAGE-BGA84	BGA	W97AH6NBVA1I	3D model available Symbol and footprint available 3	1 Download Model
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