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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W29N01HVBANF Winbond	1	1Gb SLC NAND Flash MHz VFBGA63	BGA	W29N01HVBANF	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHA Winbond	1	VFBGA100	BGA	W66AP6NBHAHA	3D model available Symbol and footprint available 3	1 Download Model
	W25Q12PWXGIQ Winbond	1	128Mb Serial NOR Flash 166MHz SON8	Small Outline No-lead	W25Q12PWXGIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KVZEIE Winbond	1	 New W25N Family of QspiNANDMemories– W25N01KV: 1G-bit / 128M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– Fast Program/Erase performance– 100,000 erase/program cycles(3)– 10-year data retention Low Power, Wide Temperature Range– Single 2.7 t	Small Outline No-lead	W25N01KVZEIE	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWBIM Winbond	1	512Mb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q512NWBIM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q40RVZPJQ Winbond	1	4Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q40RVZPJQ	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB18K Winbond	1	512Mb DDR2 SDRAM 1066MHz VFBGA84	BGA	W9751G6NB18K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB11J Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6RB11J	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB11K Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU6RB11K	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVESM Winbond	1	512Mb Serial NOR Flash 104MHz SON8 2.7V - 3.6V -40℃ ~ 85℃ / -40℃ ~ 105℃ / -40℃ ~ 125 WSON8 8X6mm	Small Outline No-lead	W25M512JVESM	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB12W Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB12W	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB09A Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W634GG8NB09A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q80RVZPJM Winbond	1	8M-bit 3.0V Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI	Small Outline No-lead	W25Q80RVZPJM	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWBSM Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JWBSM	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB11A Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W632GG8NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB11A Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB11A	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6NB-3K Winbond	1	DDR2 SDRAM 667MHz	BGA	W9751G6NB-3K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6QB-09 Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6QB-09	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6QB11I Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6QB11I	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWTBSQ Winbond	1	New Family of SpiFlash Memories– W25Q64JW: 64M-bit / 8M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.7V to 1.95Vsupply– <1µA Power-down (typ.)– -40°C to +85°C/+105°C operating range	BGA	W25Q64JWTBSQ	3D model available Symbol and footprint available 3	1 Download Model
	W9864G6KH-6W Winbond	1	 3.3V ± 0.3V for -5, -6 and -6I speed grades power supply 2.7V~3.6V for -7 speed grades power supply Up to 200 MHz Clock Frequency 1,048,576 words  4 banks  16 bits organization Self Refresh Current: Standard and Low Power CAS Latency: 2 and 3 Burst Length: 1, 2, 4, 8 and full page Sequential and Interleave Burst Byte Data Controlled by LDQM, UDQM Auto-precharge and Controlled Precharg Burst Read, Single Writes Mode 4K Refresh Cycles/64 mS Interface: LVTTL Packaged	Small Outline Packages	W9864G6KH-6W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB11K Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU8RB11K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVSFJM Winbond	1	64Mb Serial NOR Flash 133MHz SOP16	Small Outline Packages	W25Q64JVSFJM	3D model available Symbol and footprint available 3	1 Download Model
	W949D6DBHA6K Winbond	1	512Mb Low Power DDR SDRAM 333MHz VFBGA60	BGA	W949D6DBHA6K	3D model available Symbol and footprint available 3	1 Download Model
	W9725G8KB-3K Winbond	1	DDR2 SDRAM 667MHz	BGA	W9725G8KB-3K	3D model available Symbol and footprint available 3	1 Download Model
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