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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W9751G8NB-3A Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB-3A	3D model available Symbol and footprint available 3	1 Download Model
	W959D8NFYA5K Winbond	1	512Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W959D8NFYA5K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB15A Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG6NB15A	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB09I Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W634GU6RB09I	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB11W Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB11W	3D model available Symbol and footprint available 3	1 Download Model
	W29N02GVBAAF Winbond	1	2Gb SLC NAND Flash MHz VFBGA63	BGA	W29N02GVBAAF	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB11A Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB11A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWBIA Winbond	1	512Mb Serial NOR Flash 133MHz TFBGA (5X5)24	BGA	W25Q512NWBIA	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB09A Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6NB09A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB15K Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB15K	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6MB15W Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA96	BGA	W632GU6MB15W	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB11K Winbond	1	PACKAGE-BGA78	BGA	W634GU8NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6NB09K Winbond	1	1Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W631GU6NB09K	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB11A Winbond	1	4Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W634GU8NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q02NWTBIM Winbond	1	New Family of SpiFlash Memories– W25Q02NW: four 512M-bit stack die (2G-bit/ 256M-byte)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR (Double Transfer Rate) Read– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase c	BGA	W25Q02NWTBIM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16RVSNJQ Winbond	1	16Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q16RVSNJQ	3D model available Symbol and footprint available 3	1 Download Model
	W634GG8NB09W Winbond	1	DDR3 SDRAM 2133MHz	BGA	W634GG8NB09W	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6NB11A Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU6NB11A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB11S Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6NB11S	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB11W Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB11W	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB12A Winbond	1	4Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W634GU8NB12A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB15A Winbond	1	BGA78	BGA	W632GU8MB15A	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB09S Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W632GG8NB09S	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8NB11K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JVZPAM Winbond	1	64Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q64JVZPAM	3D model available Symbol and footprint available 3	1 Download Model
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