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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W9864G6KH-6J Winbond	1	64Mb SDRAM 166MHz TSOPII54	Small Outline Packages	W9864G6KH-6J	3D model available Symbol and footprint available 3	1 Download Model
	W978H6KBVX1E Winbond	1	256Mb Low Power DDR2 SDRAM 1066MHz VFBGA134	BGA	W978H6KBVX1E	3D model available Symbol and footprint available 3	1 Download Model
	W66BP6NBUAFJ Winbond	1	This is a 2Gb Low Power DDR4X SDRAM organized as 16M words x 8 banks x 16bits with single channel	BGA	W66BP6NBUAFJ	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GZBIBF Winbond	1	Basic Features– Density : 8Gbit (2 chip stacked solution)– Vcc : 1.7V to 1.95V– Bus width : x8/x16– Operating temperature Industrial: -40°C to 85°C Industrial Plus: -40°C to 105°C Single-Level Cell (SLC) technology. Organization– Density: 8G-bit/1G-byte– Page size 2,112 bytes (2048 + 64 bytes) 1,056 words (1024 + 32 words)– Block size 64 pages (128K + 4K bytes) 64 pages (64K + 2K words) Highest Performance– Read performance (Max.) Random read: 25us Sequential	BGA	W29N08GZBIBF	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWSNAQ Winbond	1	 New Family of SpiFlash Memories– W25Q32JW: 32M-bit / 4M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.7V to 1.95V supply– <0.1µA Power-down (typ.)– -40°C to +85/105°C operating ra	Small Outline Packages	W25Q32JWSNAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVSSIM Winbond	1	16Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q16JVSSIM	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6NB12J Winbond	1	4Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W634GU6NB12J	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWSSIM Winbond	1	64Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q64JWSSIM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWSNIQ Winbond	1	32Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q32JWSNIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWUUIM Winbond	1	64Mb Serial NOR Flash 133MHz SON8 ,4x3x0.60,uu package .	Other	W25Q64JWUUIM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWSSIQ Winbond	1	32Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q32JWSSIQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVTCJM Winbond	1	32Mb Serial NOR Flash 133MHz TFBGA (4X6)24	BGA	W25Q32JVTCJM	3D model available Symbol and footprint available 3	1 Download Model
	W66BQ6NBUAHJ Winbond	1	This is a 2Gb Low Power DDR4X SDRAM organized as 16M words x 8 banks x 16bits with single channel	BGA	W66BQ6NBUAHJ	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB15K Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6NB15K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8NB09S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8NB09S	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB11K Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W631GG8MB11K	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVBANA Winbond	1	1Gb SLC NAND Flash MHz VFBGA63	BGA	W29N01HVBANA	3D model available Symbol and footprint available 3	1 Download Model
	W9725G8KB-3W Winbond	1	WBGA60	BGA	W9725G8KB-3W	3D model available Symbol and footprint available 3	1 Download Model
	W97BH2MBVA1K Winbond	1	VFBGA134	BGA	W97BH2MBVA1K	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB11J Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU6RB11J	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8NB15S Winbond	1	2Gb DDR3 SDRAM 1333MHz VFBGA78	BGA	W632GU8NB15S	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB11K Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU8RB11K	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVCSM Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JVCSM	3D model available Symbol and footprint available 3	1 Download Model
	W9864G6KH-6A Winbond	1	166MHz/CL3 2mA 0°C ~ 70°C TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant 2.7V~3.6V for -7 speed grades power supply	Small Outline Packages	W9864G6KH-6A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB12S Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W632GU6RB12S	3D model available Symbol and footprint available 3	1 Download Model
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