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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W631GG8NB15K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8NB15K	3D model available Symbol and footprint available 3	1 Download Model
	W94AD6KBHA5A Winbond	1	\VFBGA60	BGA	W94AD6KBHA5A	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB15K Winbond	1	DDR3 SDRAM 1333MHz	BGA	W634GG6NB15K	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JWZPSQ Winbond	1	 New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.65V to 1.95V supply– <0.1µA Power-down (typ.)– -40°C to +85°C operating range	Small Outline No-lead	W25Q16JWZPSQ	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6NB09S Winbond	1	⚫ Power Supply: VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG6NB09S	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32RVSSJM Winbond	1	32Mb Serial NOR Flash 133MHz SOP8	Small Outline Packages	W25Q32RVSSJM	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVDJNF Winbond	1	SLC NAND Flash MHz	BGA	W29N01HVDJNF	3D model available Symbol and footprint available 3	1 Download Model
	W25N01JWTBAG Winbond	1	1Gb QspiNAND Flash 166MHz TFBGA (5X5)24	BGA	W25N01JWTBAG	3D model available Symbol and footprint available 3	1 Download Model
	W9825G6KB-6 Winbond	1	DRAM 256Mb SDR SDRAM x16, 166MHz,	BGA	W9825G6KB-6	3D model available Symbol and footprint available 3	1 Download Model
	W958D6NBKX5I Winbond	1	PSRAM (Pseudo SRAM) Memory IC 256Mbit HyperBus 200 MHz 35 ns 49-WFBGA (4x4)	BGA	W958D6NBKX5I	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB12S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6MB12S	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB09K Winbond	1	1Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W631GU8RB09K	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB09A Winbond	1	4Gb DDR3 SDRAM 2133MHz VFBGA78	BGA	W634GU8NB09A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JVUXAM Winbond	1	 New Family of SpiFlash Memories– W25Q16JV: 16M-bit / 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/	Small Outline No-lead	W25Q16JVUXAM	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8NB09A Winbond	1	DDR3 SDRAM 2133MHz	BGA	W631GU8NB09A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWEIN Winbond	1	512Mb Serial NOR Flash 133MHz SON8	Small Outline No-lead	W25Q512NWEIN	3D model available Symbol and footprint available 3	1 Download Model
	W972GG6KB18K Winbond	1	2Gb DDR2 SDRAM 1066MHz WBGA84	BGA	W972GG6KB18K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB12A Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6NB12A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB15S Winbond	1	DDR3 SDRAM 1333MHz	BGA	W631GU8MB15S	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6MB09K Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6MB09K	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB11S Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8MB11S	3D model available Symbol and footprint available 3	1 Download Model
	W25Q10RLXHJM Winbond	1	 New Family of SpiFlash Memories– W25Q40RL: 4M-bit /512K-byte (524,288)W20Q20RL: 2M-bit /256K-byte (262,144)W20Q10RL: 1M-bit /128K-byte (131,072)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More	Small Outline No-lead	W25Q10RLXHJM	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6NB12W Winbond	1	4Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W634GU6NB12W	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB12S Winbond	1	DDR3 SDRAM 1600MHz	BGA	W634GU6RB12S	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6KB-3W Winbond	1	DDR2 SDRAM 667MHz	BGA	W9751G6KB-3W	3D model available Symbol and footprint available 3	1 Download Model
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