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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W631GU6RB-12 Winbond	1	1Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W631GU6RB-12	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB25W Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB25W	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6MB11A Winbond	1	 Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V Backward compatible to VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, d	BGA	W631GU6MB11A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8NB09K Winbond	1	DDR3 SDRAM 2133MHz	BGA	W631GU8NB09K	3D model available Symbol and footprint available 3	1 Download Model
	W25X10CLUXIG Winbond	1	1Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25X10CLUXIG	3D model available Symbol and footprint available 3	1 Download Model
	W25N01GVSFAG Winbond	1	1Gb QspiNAND Flash 104MHz SOP16	Small Outline Packages	W25N01GVSFAG	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWBJM Winbond	1	 New Family of SpiFlash Memories– W25Q512NW: 512M-bit / 64M-byte– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– SPI/QPI DTR (Double Transfer Rate) Read– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-y	BGA	W25Q512NWBJM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JWUUSM Winbond	1	FLASH - NOR Memory IC 32Mbit SPI - Quad I/O 133 MHz 8-USON (4x3)	Other	W25Q32JWUUSM	3D model available Symbol and footprint available 3	1 Download Model
	W25Q64JWUUSQ Winbond	1	64Mb Serial NOR Flash 104MHz SON8	Other	W25Q64JWUUSQ	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVBKNF Winbond	1	1Gb SLC NAND Flash MHz VFBGA63	BGA	W29N01HVBKNF	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB09A Winbond	1	DDR3 SDRAM 2133MHz	BGA	W634GU6RB09A	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB15S Winbond	1	SDRAM - DDR3 Memory IC 1Gbit Parallel 667 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB15S	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8NB15S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8NB15S	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVSNSM Winbond	1	 New Family of SpiFlash Memories– W25Q32JV: 32M-bit / 4M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles per sector– More than 20-year data retention Efficient “Continuous Read”– Continuous Read with 8/16/32/64-Byte	Small Outline Packages	W25Q32JVSNSM	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6NB15W Winbond	1	DDR3 SDRAM 1333MHz	BGA	W634GU6NB15W	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KWZEJG Winbond	1	1Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N01KWZEJG	3D model available Symbol and footprint available 3	1 Download Model
	W25Q16JWXHAQ Winbond	1	FEATURES New Family of SpiFlash Memories– W25Q16JW: 16M-bit / 2M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Quad I/O SPI clocks– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Low Power, Wide Temperature Range– Single 1.65V to 1.95V supply– <0.1µA Power-down (typ.)– -40°C to +85°C opera	Small Outline No-lead	W25Q16JWXHAQ	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB09S Winbond	1	VFBGA - 78	BGA	W632GU8MB09S	3D model available Symbol and footprint available 3	1 Download Model
	W25N04KVTBJU Winbond	1	 New W25N Family of QspiNANDMemories– W25N04KV: 4G-bit / 512M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S sequential data transfer rate– Fast Program/Erase performance– 60,000 erase/program cycles– 10-year data retention Low Power, Wi	BGA	W25N04KVTBJU	3D model available Symbol and footprint available 3	1 Download Model
	W9725G8KB18W Winbond	1	DDR2 SDRAM 1066MHz	BGA	W9725G8KB18W	3D model available Symbol and footprint available 3	1 Download Model
	W66BQ6NBUAHA Winbond	1	2Gb Low Power DDR4/4X SDRAM 4267MHz WFBGA200	BGA	W66BQ6NBUAHA	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KWZEJE Winbond	1	1Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N01KWZEJE	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB11S Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6NB11S	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8RB11A Winbond	1	DDR3 SDRAM 1866MHz	BGA	W634GU8RB11A	3D model available Symbol and footprint available 3	1 Download Model
	W634GU6RB12K Winbond	1	DDR3 SDRAM 1600MHz	BGA	W634GU6RB12K	3D model available Symbol and footprint available 3	1 Download Model
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