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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W632GU8NB12S Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA78	BGA	W632GU8NB12S	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB09K Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W631GG8MB09K	3D model available Symbol and footprint available 3	1 Download Model
	W634GG6NB12A Winbond	1	4Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W634GG6NB12A	3D model available Symbol and footprint available 3	1 Download Model
	W9725G6KB-3K Winbond	1	4M x 4 BANKS x 16 BIT DDR2 SDRAM	BGA	W9725G6KB-3K	3D model available Symbol and footprint available 3	1 Download Model
	W97AH2KBVA2A Winbond	1	PACKAGE-BGA134	BGA	W97AH2KBVA2A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB09J Winbond	1	1Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W631GU6RB09J	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB12K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W631GG8MB12K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8NB11K Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA78	BGA	W632GG8NB11K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB12K Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6MB12K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6NB12W Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6NB12W	3D model available Symbol and footprint available 3	1 Download Model
	W35T51NWTBIE Winbond	1	New Octal DDR SpiFlash Memories– W35T51NW: 512M-bit / 64M-byte Supported Synchronous Bus Interface– Byte-Wide (x8) Multiplexed Synchronous IO– Single Data Rate (SDR) and Double Data Rate(DDR)– DDR Bus Mode– Octal Double Data Rate (ODDR) protocol:CLK, /CS, IO[7:0], DS, /Reset– Extended SPI (SDR Bus Mode) – Octal SPI (OSPI) and OSPI DDR protocol :CLK, /CS, IO[7:0] /WP, /Reset – Standard SPI protocol (SPI):CLK, /CS, IO0, IO1, /WP, /Reset Clock Frequency– 166 MHz SDR max (166 MB/	BGA	W35T51NWTBIE	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512NWFIA Winbond	1	 New Family of SpiFlash Memories– W25Q512NW: 512M-bit / 64M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient Read– Allows true XIP (execute i	Small Outline Packages	W25Q512NWFIA	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAGA Winbond	1	BGA100	BGA	W66AQ6NBHAGA	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB09A Winbond	1	2Gb DDR3 SDRAM 2133MHz VFBGA96	BGA	W632GU6RB09A	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6NB15A Winbond	1	1Gb DDR3 SDRAM 1333MHz VFBGA96	BGA	W631GU6NB15A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6RB11S Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6RB11S	3D model available Symbol and footprint available 3	1 Download Model
	W9751G8NB18A Winbond	1	 Power Supply: VDD, VDDQ = 1.8 V ± 0.1V Double Data Rate architecture: two data transfers per clock cycle CAS Latency: 3, 4, 5, 6 and 7 Burst Length: 4 and 8 Bi-directional, differential data strobes (DQS andDQS) are transmitted / received with data Edge-aligned with Read data and center-aligned with Write data DLL aligns DQ and DQS transitions with clock Differential clock inputs (CLK andCLK) Data masks (DM) for write data Commands entered on each positive CLK edge, data	BGA	W9751G8NB18A	3D model available Symbol and footprint available 3	1 Download Model
	W634GU8NB15A Winbond	1	DDR3 SDRAM 1333MHz	BGA	W634GU8NB15A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6NB09K Winbond	1	SDRAM - DDR3L Memory IC 2Gbit Parallel 800 MHz 20 ns 96-VFBGA (7.5x13)	BGA	W632GU6NB09K	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB11S Winbond	1	DDR3 SDRAM 1866MHz Memory IC 2Gbit Parallel 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB11S	3D model available Symbol and footprint available 3	1 Download Model
	W9751G6KB18W Winbond	1	DDR2 SDRAM 1066MHz	BGA	W9751G6KB18W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB12A Winbond	1	2Gb DDR3 SDRAM 1600MHz VFBGA96	BGA	W632GU8RB12A	3D model available Symbol and footprint available 3	1 Download Model
	W979H6KBVA1A Winbond	1	VFBGA134	BGA	W979H6KBVA1A	3D model available Symbol and footprint available 3	1 Download Model
	W25N02KWTBJU Winbond	1	 New W25N Family of QspiNANDMemories– W25N02KW: 2G-bit / 256M-Byte– Standard SPI: CLK, /CS, DI, DO, /WP,/Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Compatible SPI serial flash commands Highest Performance Serial NAND Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S sequential data transfer rate– Fast Program/Erase performance– 100,000 erase/program cycles(5) (6)– 10-year data retention Low P	BGA	W25N02KWTBJU	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWSFJQ Winbond	1	 New Family of SpiFlash Memories– W25Q01NW: two 512M-bit / 128M-byte– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1,– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Standard/Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient “Continuous Read”– Quad Peri	Small Outline Packages	W25Q01NWSFJQ	3D model available Symbol and footprint available 3	1 Download Model
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Winbond

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