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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W25Q16RVXHJQ Winbond	1	 New Family of SpiFlash Memories– W25Q16RV: 16M-bit/ 2M-byte (2,097,152)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– Software & Hardware Reset(1) Highest Performance Serial Flash– 133MHz Single, Dual/Quad SPI clocks– 266/532MHz equivalent Dual/Quad SPI– 66MB/S continuous data transfer rate– Min. 100K Program-Erase cycles– More than 20-year data retention Efficient “Continuous Read” and QPI Mode– Continuous Read with 8/16	Small Outline No-lead	W25Q16RVXHJQ	3D model available Symbol and footprint available 3	1 Download Model
	W25Q01NWSFJM Winbond	1	1Gb Serial NOR Flash 133MHz SOP16	Small Outline Packages	W25Q01NWSFJM	3D model available Symbol and footprint available 3	1 Download Model
	W66BQ6NBUAGK Winbond	1	2Gb Low Power DDR4/4X SDRAM 3733MHz WFBGA200	BGA	W66BQ6NBUAGK	3D model available Symbol and footprint available 3	1 Download Model
	W25Q32JVSFSM Winbond	1	32Mb Serial NOR Flash 133MHz SOP16	Small Outline Packages	W25Q32JVSFSM	3D model available Symbol and footprint available 3	1 Download Model
	W957D8MFYA5K Winbond	1	128Mb HYPERRAM 400MHz TFBGA (5X5)24	BGA	W957D8MFYA5K	3D model available Symbol and footprint available 3	1 Download Model
	W25N02KWZEJR Winbond	1	2Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N02KWZEJR	3D model available Symbol and footprint available 3	1 Download Model
	W9725G6KB18W Winbond	1	DDR2 SDRAM 1066MHz	BGA	W9725G6KB18W	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVCSQ Winbond	1	FLASH - NOR Memory IC 512Mbit SPI 104 MHz	BGA	W25M512JVCSQ	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHS Winbond	1	BGA100	BGA	W66AP6NBHAHS	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB15A Winbond	1	SDRAM - DDR3 Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GG8MB15A	3D model available Symbol and footprint available 3	1 Download Model
	W978H6KBVA1K Winbond	1	256Mb Low Power DDR2 SDRAM 1066MHz VFBGA134	BGA	W978H6KBVA1K	3D model available Symbol and footprint available 3	1 Download Model
	W29N02GZBABF Winbond	1	2Gb SLC NAND Flash MHz VFBGA63	BGA	W29N02GZBABF	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8RB09S Winbond	1	32M x 8 BANKS x 8 BIT DDR3L SDRAM	BGA	W632GU8RB09S	3D model available Symbol and footprint available 3	1 Download Model
	W631GU6RB11I Winbond	1	1Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W631GU6RB11I	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWCAM Winbond	1	 New Family of SpiFlash® Memories– W25M512JW-IQ: 2 x 256M-bit (2 x 32MByte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 52MB/s continuous data transfer rate– More than 100,000 Program/Erase cycles– More than 20-year data retention	BGA	W25M512JWCAM	3D model available Symbol and footprint available 3	1 Download Model
	W25N01KVZPIR Winbond	1	1Gb QspiNAND Flash 104MHz SON8	Small Outline No-lead	W25N01KVZPIR	3D model available Symbol and footprint available 3	1 Download Model
	W25N512GWEIU Winbond	1	512Mb Serial NAND Flash Memory with uniform 2KB+64B page size and set Buffer Read Mode as default	Small Outline No-lead	W25N512GWEIU	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAHJ Winbond	1	VFBGA100	BGA	W66AP6NBHAHJ	3D model available Symbol and footprint available 3	1 Download Model
	W66AQ6NBHAGJ Winbond	1	VFBGA100	BGA	W66AQ6NBHAGJ	3D model available Symbol and footprint available 3	1 Download Model
	W638GU6QB-11 Winbond	1	⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, differential data strobes (DQS and DQS#) are transmitted / r	BGA	W638GU6QB-11	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8RB09I Winbond	1	Power Supply: 1.35V (typ.), VDD, VDDQ = 1.283V to 1.45V⚫ Backward compatible to VDD, VDDQ = 1.5V ± 0.075V⚫ Double Data Rate architecture: two data transfers per clock cycle⚫ Eight internal banks for concurrent operation⚫ 8 bit prefetch architecture⚫ CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14⚫ Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)⚫ Programmable read burst ordering: interleaved or nibble sequential⚫ Bi-directional, dif	BGA	W631GU8RB09I	3D model available Symbol and footprint available 3	1 Download Model
	W631GG8MB15W Winbond	1	SDRAM - DDR3 Memory IC 1Gbit Parallel 667 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GG8MB15W	3D model available Symbol and footprint available 3	1 Download Model
	W979H6KBVA2A Winbond	1	Low Power DDR2 SDRAM 800MHz	BGA	W979H6KBVA2A	3D model available Symbol and footprint available 3	1 Download Model
	W25Q512JVFJQ Winbond	1	512Mb Serial NOR Flash 133MHz SOP16	Small Outline Packages	W25Q512JVFJQ	3D model available Symbol and footprint available 3	1 Download Model
	W66AP6NBHAFK Winbond	1	1Gb Low Power DDR4/4X SDRAM 3200MHz VFBGA100	BGA	W66AP6NBHAFK	3D model available Symbol and footprint available 3	1 Download Model
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